Reduced Profile Electronics Packaging

Problem Statement

Orbital Sciences Corporation (OSC), Launch Systems Group (LSG) has requested a redesign for their avionics control housing. Particular vehicle designs require a housing that will have less head height to mount in smaller areas. We propose to design a new module assembly and new module housing as needed to fulfill the requirements.

Requirements

Below is a list of the requirements communicated to us through Orbital. The first set includes the manditory attributes of the finished design. The second set (indented) outlines optimizations that are not crucial to the functionality of the design, but are desired to be optimized to create a more flexible and robust product.

 D-Subminiature Connectors
 D-Subminiature Connectors
 D-Subminiature Connectors